Addressing planar noise coupling in multilayer PCB structures
In this paper, a new formulation is provided to model the noise coupling between adjacent planes in a multilayer stackup. A model is developed to show that the planar coupling depends heavily on the wave impedance of each power plane. Also a rigorous investigation of planar noise coupling with respect to the separation distance between the planes and use of decoupling capacitors is presented. The validity of the developed model is successfully tested on sample structures.
|Keywords||decoupling capacitor, planar coupling, power delivery network, power noise|
|Conference||2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016|
Erdin, I. (Ihsan), & Achar, R. (2016). Addressing planar noise coupling in multilayer PCB structures. In IEEE International Symposium on Electromagnetic Compatibility (pp. 187–190). doi:10.1109/ISEMC.2016.7571641