Additional Metadata
Keywords High speed interconnects, model-order reduction (MOR), overlapping partitioning (OP), transient analysis, transverse partitioning (TP), waveform relaxation (WR).
Persistent URL dx.doi.org/10.1109/TCPMT.2014.2331348
Journal IEEE Transactions on Components, Packaging and Manufacturing Technology
Citation
Farhan, M.A. (Mina A.), Nakhla, N.M. (Natalie M.), Nakhla, M.S, & Achar, R. (2014). Fast transient analysis of tightly coupled interconnects via overlapping partitioning and model-order reduction. IEEE Transactions on Components, Packaging and Manufacturing Technology, 4(10), 1648–1656. doi:10.1109/TCPMT.2014.2331348