Additional Metadata
Persistent URL dx.doi.org/10.1109/TCPMT.2013.2286712
Journal IEEE Transactions on Components, Packaging and Manufacturing Technology
Citation
Achar, R, & Maffucci, A. (Antonio). (2013). Foreword: Special section on RF, 3-D-ICs and interconnects. IEEE Transactions on Components, Packaging and Manufacturing Technology, 3(11), 1889–1890. doi:10.1109/TCPMT.2013.2286712