Additional Metadata
Persistent URL dx.doi.org/10.1109/ESTC.2010.5642961
Conference 3rd Electronics System Integration Technology Conference, ESTC 2010
Citation
Triverio, P. (Piero), Nakhla, M.S, & Grivet-Talocia, S. (Stefano). (2010). Passive parametric modeling of interconnects and packaging components from sampled impedance, admittance or scattering data. In Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. doi:10.1109/ESTC.2010.5642961