With the trend towards finer feature size, increased density and higher signal speeds in today's designs, signal integrity and thermal management play significant roles towards system functionality and reliability. In practice, design optimizations for thermal performance and electrical performance are done in isolation of one another, usually resulting in a sub-optimal design. In this paper, a CAD technique is proposed for concurrent thermal and electrical design optimization. The methodology is developed and applied at the printed circuit board level.

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Conference Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
Mihan, Khashayar K., Stacey, Brian J., Nakhla, M.S, & Zhang, Q.J. (1995). Concurrent thermal and electrical optimization of high-speed packages and systems. In American Society of Mechanical Engineers, EEP (pp. 221–227).