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Conference Proceedings of the 1996 5th Intersociety Conference on Thermal Phenomena in Electronic Systems
Citation
Phanilatha, V., Nakhla, M.S, Zhang, Q.J, & Liu, Da-Guang. (1996). Finite element transient thermal analysis of electronic boards and packages using moment-matching techniques. In Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (pp. 391–395).