Additional Metadata
Keywords LTCC packaging, Mach-Zehnder modulator, MMIC power amplifier, Parametrized model reduction, Thermal model
Persistent URL dx.doi.org/10.1117/12.566311
Conference Photonics North 2004: International Conference on Applications of Photonic Technology, ICAPT
Citation
Celo, D., Smy, T, Guo, X., Romo, G., & Roy, L. (2004). Thermal modeling of a GaAs-based Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier. In Proceedings of SPIE - The International Society for Optical Engineering (pp. 540–547). doi:10.1117/12.566311