Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator

2001-01-01

Journal of Vacuum Science and Technology A , Volume 19 - Issue 1 p. 251- 261

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Persistent URL	dx.doi.org/10.1116/1.1329124
Journal	Journal of Vacuum Science and Technology A
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style BibTex Format Endnote Format RIS Format CSL Format	Smy, T. (2001). Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator. Journal of Vacuum Science and Technology A, 19(1), 251–261. doi:10.1116/1.1329124

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