Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator

2001

Additional Metadata
Persistent URL	doi.org/10.1116/1.1329124
Journal	Journal of Vacuum Science and Technology A
Organisation	Department of Electronics
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Smy, T. (2001). Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator. Journal of Vacuum Science and Technology A, 19(1), 251–261. doi:10.1116/1.1329124

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