Analysis of transmission line circuits using multi-dimensional model reduction techniques

2001-12-01

Presented at the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (October 2001)

Additional Metadata
Conference	IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Organisation	Department of Electronics
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2001). Analysis of transmission line circuits using multi-dimensional model reduction techniques. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 43–46).

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