2001-12-01
Analysis of transmission line circuits using multi-dimensional model reduction techniques
Publication
Publication
Presented at the
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (October 2001)
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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging | |
Organisation | Department of Electronics |
Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2001). Analysis of transmission line circuits using multi-dimensional model reduction techniques. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 43–46).
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