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doi.org/10.1109/TADVP.2002.803271
IEEE Transactions on Advanced Packaging
Department of Electronics

Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2002). Analysis of transmission line circuits using multidimensional model reduction techniques. In IEEE Transactions on Advanced Packaging (Vol. 25, pp. 174–180). doi:10.1109/TADVP.2002.803271