Analysis of transmission line circuits using multidimensional model reduction techniques

2002-05-01

IEEE Transactions on Advanced Packaging , Volume 25 - Issue 2 p. 174- 180

Additional Metadata
Keywords	Circuit optimization, Circuit simulation, Design automation, Multiconductor transmission lines, Reduced order systems, Sensitivity
Persistent URL	doi.org/10.1109/TADVP.2002.803271
Journal	IEEE Transactions on Advanced Packaging
Organisation	Department of Electronics
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2002). Analysis of transmission line circuits using multidimensional model reduction techniques. In IEEE Transactions on Advanced Packaging (Vol. 25, pp. 174–180). doi:10.1109/TADVP.2002.803271

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