Analysis of transmission line circuits using multidimensional model reduction techniques

2002-05-01

IEEE Transactions on Advanced Packaging , Volume 25 - Issue 2 p. 174- 180

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Keywords	Circuit optimization, Circuit simulation, Design automation, Multiconductor transmission lines, Reduced order systems, Sensitivity
Persistent URL	dx.doi.org/10.1109/TADVP.2002.803271
Journal	IEEE Transactions on Advanced Packaging
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2002). Analysis of transmission line circuits using multidimensional model reduction techniques. In IEEE Transactions on Advanced Packaging (Vol. 25, pp. 174–180). doi:10.1109/TADVP.2002.803271

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