2002-05-01
Analysis of transmission line circuits using multidimensional model reduction techniques
Publication
Publication
IEEE Transactions on Advanced Packaging
,
Volume 25
-
Issue 2
p. 174-
180
| Additional Metadata | |
|---|---|
| Keywords | Circuit optimization, Circuit simulation, Design automation, Multiconductor transmission lines, Reduced order systems, Sensitivity |
| Persistent URL | dx.doi.org/10.1109/TADVP.2002.803271 |
| Journal | IEEE Transactions on Advanced Packaging |
| Citation |
Gunupudi, P, Khazaka, R. (Roni), & Nakhla, M.S. (2002). Analysis of transmission line circuits using multidimensional model reduction techniques. In IEEE Transactions on Advanced Packaging (Vol. 25, pp. 174–180). doi:10.1109/TADVP.2002.803271
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