This paper proposes a new approach for realizing a compact 3-D 90° hybrid coupler incorporating compact meandered elevated coplanar waveguides (ECPW), thin-film microstrip (TFMS) transmission lines, and micro coaxial shunt stub loading. The design technique has been successfully demonstrated using a multi-layer 90nm CMOS process. The proposed coupler takes advantage of the multi-level metallization processes offered in CMOS technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced with a size reduction of 81 % in circuit area at 60 GHz as compared to that of a conventional hybrid coupler using the ECPW/TFMS configuration. Simulated and experimental results are presented in support of the novel miniature coupler.

Additional Metadata
Keywords Capacitive loading, CMOS, ECPW, Micro coaxial, Millimeter waves, Multilayer circuits, Size reduction, TFMS
Persistent URL dx.doi.org/10.1109/MWSYM.2010.5517131
Conference 2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Citation
Hettak, K. (K.), Amaya, R, & Morin, G.A. (G. A.). (2010). A novel compact three-dimensional CMOS branch-line coupler using the meandering ECPW, TFMS, and buried micro coaxial technologies at 60 GHz. In IEEE MTT-S International Microwave Symposium Digest (pp. 1576–1579). doi:10.1109/MWSYM.2010.5517131