This paper proposes a new approach for realizing a compact 3-D 90° hybrid coupler incorporating compact meandered elevated coplanar waveguides (ECPW), thin-film microstrip (TFMS) transmission lines, and micro coaxial shunt stub loading. The design technique has been successfully demonstrated using a multi-layer 90nm CMOS process. The proposed coupler takes advantage of the multi-level metallization processes offered in CMOS technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced with a size reduction of 81 % in circuit area at 60 GHz as compared to that of a conventional hybrid coupler using the ECPW/TFMS configuration. Simulated and experimental results are presented in support of the novel miniature coupler.

Capacitive loading, CMOS, ECPW, Micro coaxial, Millimeter waves, Multilayer circuits, Size reduction, TFMS
dx.doi.org/10.1109/MWSYM.2010.5517131
2010 IEEE MTT-S International Microwave Symposium, MTT 2010

Hettak, K. (K.), Amaya, R, & Morin, G.A. (G. A.). (2010). A novel compact three-dimensional CMOS branch-line coupler using the meandering ECPW, TFMS, and buried micro coaxial technologies at 60 GHz. In IEEE MTT-S International Microwave Symposium Digest (pp. 1576–1579). doi:10.1109/MWSYM.2010.5517131