2018-01-20
Analysis of decoupling capacitors inside via arrays with mutual interaction
Publication
Publication
Presented at the
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 (December 2017), Haining, Zhejiang
A new method is developed to assess the effectiveness of local decoupling capacitors on parallel-plate power and ground conductors. The proposed method calculates the loop-inductance of multiple capacitors including their mutual interactions and the effect of power and ground vias. The underlying theory is based on computing the driving point impedance of a device power pin which serves as a reference in the evaluation of capacitor's effectiveness. The accuracy of the proposed method is validated by comparing the results to those from a full-wave electromagnetic simulation.
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| doi.org/10.1109/EDAPS.2017.8276971 | |
| 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 | |
| Organisation | Department of Electronics |
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Erdin, I. (Ihsan), & Achar, R. (2018). Analysis of decoupling capacitors inside via arrays with mutual interaction. In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 (pp. 1–3). doi:10.1109/EDAPS.2017.8276971
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