Additional Metadata
Keywords C4/CBGA package, Compact modeling, GaN MESFET, Integrated circuit (IC) component, Multidimensional model reduction, Silicon on insulator (SOI) clock driver, Thermal analysis
Persistent URL dx.doi.org/10.1109/TCAPT.2004.838877
Journal IEEE Transactions on Components and Packaging Technologies
Citation
Celo, D. (Dritan), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). Fast simulation of steady-state temperature distributions in electronic components using multidimensional model reduction. IEEE Transactions on Components and Packaging Technologies, 28(1), 70–79. doi:10.1109/TCAPT.2004.838877