Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects
This paper presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission line (MTL) interconnects in the presence of electromagnetic interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.
|Conference||IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging|
Shinh, G. (Gurpreet), Nakhla, N. (Natalie), Achar, R, Nakhla, M.S, Dounavis, A. (Anestis), & Erdin, I. (Ihsan). (2004). Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 277–280).