This paper presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission line (MTL) interconnects in the presence of electromagnetic interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.

Additional Metadata
Conference IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
Citation
Shinh, G. (Gurpreet), Nakhla, N. (Natalie), Achar, R, Nakhla, M.S, Dounavis, A. (Anestis), & Erdin, I. (Ihsan). (2004). Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 277–280).