2004-12-01
Simulation of coupled interconnects using waveform relaxation and transverse partitioning
Publication
Publication
Presented at the
IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging (October 2004)
The large number of coupled lines in an interconnect structure is a serious limiting factor in simulating high-speed circuits. A new method is presented for simulation of large interconnects based on the transverse partitioning concept and waveform relaxation techniques. The computational complexity of the proposed algorithm grows linearly with the number of coupled lines. In addition, the algorithm is highly suitable for parallel implementation leading to further significant reduction in the computational complexity.
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Conference | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
Citation |
Nakhla, N. (Natalie), Ruehli, A. (Albert), Nakhla, M.S, & Achar, R. (2004). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 25–28).
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