GaAs power amplifier, Model reduction, Multichip module ball grid array (MCMBGA), Parametrized thermal compact model, Thermal modeling
IEEE Transactions on Advanced Packaging
Department of Electronics

Celo, D. (Dritan), Guo, X. (Xiaoming), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). The creation of compact thermal models of electronic components using model reduction. IEEE Transactions on Advanced Packaging, 28(2), 240–251. doi:10.1109/TADVP.2005.846942