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Keywords GaAs power amplifier, Model reduction, Multichip module ball grid array (MCMBGA), Parametrized thermal compact model, Thermal modeling
Persistent URL
Journal IEEE Transactions on Advanced Packaging
Celo, D. (Dritan), Guo, X. (Xiaoming), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). The creation of compact thermal models of electronic components using model reduction. IEEE Transactions on Advanced Packaging, 28(2), 240–251. doi:10.1109/TADVP.2005.846942