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doi.org/10.1109/TADVP.2005.846942
IEEE Transactions on Advanced Packaging
Department of Electronics

Celo, D. (Dritan), Guo, X. (Xiaoming), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). The creation of compact thermal models of electronic components using model reduction. IEEE Transactions on Advanced Packaging, 28(2), 240–251. doi:10.1109/TADVP.2005.846942