Additional Metadata
Keywords GaAs power amplifier, Model reduction, Multichip module ball grid array (MCMBGA), Parametrized thermal compact model, Thermal modeling
Persistent URL dx.doi.org/10.1109/TADVP.2005.846942
Journal IEEE Transactions on Advanced Packaging
Citation
Celo, D. (Dritan), Guo, X. (Xiaoming), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). The creation of compact thermal models of electronic components using model reduction. IEEE Transactions on Advanced Packaging, 28(2), 240–251. doi:10.1109/TADVP.2005.846942