3D SSY Estimate of EPFM Constraint Parameter under Biaxial Loading for Sensor Structure Design
Sensors , Volume 19 - Issue 3
Conventional sensor structure design and related fracture mechanics analysis are based on the single J-integral parameter approach of elastic-plastic fracture mechanics (EPFM). Under low crack constraint cases, the EPFM one-parameter approach generally gives a stress overestimate, which results in a great cost waste of labor and sensor components. The J-A two-parameter approach overcomes this limitation. To enable the extensive application of the J-A approach on theoretical research and sensor engineering problem, under small scale yielding (SSY) conditions, the authors developed an estimate method to conveniently and quickly obtain the constraint (second) parameter A values directly from T-stress. Practical engineering application of sensor structure analysis and design focuses on three-dimensional (3D) structures with biaxial external loading, while the estimate method was developed based on two-dimensional (2D) plain strain condition with uniaxial loading. In the current work, the estimate method was successfully extended to a 3D structure with biaxial loading cases, which is appropriate for practical sensor design. The estimate method extension and validation process was implemented through a thin 3D single edge cracked plate (SECP) specimen. The process implementation was completed in two specified planes of 3D SECP along model thickness. A wide range of material and geometrical properties were applied for the extension and validation process, with material hardening exponent value 3, 5 and 10, and crack length ratio 0.1, 0.3 and 0.7.
|biaxial loading, constraint parameter, estimate method, sensor design, sensor structure analysis, small scale yielding, T-stress, three-dimensional, two parameter approach|
|Organisation||Department of Mechanical and Aerospace Engineering|
Ding, P. (Ping), & Wang, X. (2019). 3D SSY Estimate of EPFM Constraint Parameter under Biaxial Loading for Sensor Structure Design. Sensors, 19(3). doi:10.3390/s19030735