Additional Metadata
Keywords Broad band power amplifier, Integrated circuit (IC) module, Parametrized reduction technique, Thermal analysis, Thermal macro-model
Persistent URL dx.doi.org/10.1109/TCAPT.2005.848530
Journal IEEE Transactions on Components and Packaging Technologies
Citation
Celo, D. (Dritan), Guo, X.M. (Xiao Ming), Gunupudi, P, Khazaka, R. (Roni), Walkey, D.J. (David J.), Smy, T, & Nakhla, M.S. (2005). Hierarchical thermal analysis of large IC modules. IEEE Transactions on Components and Packaging Technologies, 28(2), 207–217. doi:10.1109/TCAPT.2005.848530