A multiple-input/multiple-output (MIMO) transceiver RFIC compliant with IEEE 802.11a/b/g and Japan wireless LAN (WLAN) standards is presented. The transceiver has two complete radio paths integrated on the same chip. When two chips are used in tandem to form a four-path composite beam forming (CBF) system, 15 dB of link margin improvement is obtained. The transceiver was implemented in a 47-GHz SiGe technology with 29.1-mm2 die size. It consumes 195 mA in RX mode and 240 mA in TX mode from a 2.75-V supply.

Additional Metadata
Keywords 802.11 a/b/g, Multiple-input/multiple-output (MIMO), RFIC, SiGe, Transceivers, Wireless communications, Wireless LAN (WLAN)
Persistent URL dx.doi.org/10.1109/JSSC.2005.852419
Journal IEEE Journal of Solid-State Circuits
Citation
Rahn, D.G. (David G.), Cavin, M.S. (Mark S.), Dai, F.F. (Fa Foster), Fong, N.H.W. (Neric H. W.), Griffith, R. (Richard), Macedo, J. (José), … Toner, M. (Mike). (2005). A fully integrated multiband MIMO WLAN transceiver RFIC. IEEE Journal of Solid-State Circuits, 40(8), 1629–1640. doi:10.1109/JSSC.2005.852419