A multiobjective evolutionary method is proposed for the optimization of surface mount device (SMD) multilayer ceramic chip (MLCC) capacitors used for decoupling on printed circuit boards (PCBs) with resonant power-ground plane pairs. The proposed approach provides options for designers to meet power integrity specifications by employing uniform-valued capacitors that help to reduce the bill-of-material (BOM) cost and mitigate the part procurement risk. It is also shown that uniform MLCC capacitors with variable distance from power pins can have a similar decoupling effect to an assortment of capacitors. By simultaneously optimizing the pin-capacitor distance and value, the proposed method is shown to allow for the allocation of fewer decoupling capacitors under the ball-grid-array (BGA) pin field of an integrated circuit (IC) device.

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IEEE Transactions on Components, Packaging and Manufacturing Technology
Department of Electronics

Erdin, I. (Ihsan), & Achar, R. (2019). Multi-Objective Optimization of Decoupling Capacitors for Placement and Component Value. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(10), 1976–1983. doi:10.1109/TCPMT.2019.2930565