2006-02-01
Simulation of coupled interconnects using waveform relaxation and transverse partitioning
Publication
Publication
IEEE Transactions on Advanced Packaging , Volume 29 - Issue 1 p. 78- 87
Additional Metadata | |
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High-speed interconnects, Macromodeling, Parallel processing, Transient simulation, Transverse partitioning, Waveform relaxation | |
dx.doi.org/10.1109/TADVP.2005.862656 | |
IEEE Transactions on Advanced Packaging | |
Organisation | Department of Electronics |
Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), Nakhla, M.S, & Achar, R. (2006). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. IEEE Transactions on Advanced Packaging, 29(1), 78–87. doi:10.1109/TADVP.2005.862656
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