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doi.org/10.1109/TADVP.2005.862656
IEEE Transactions on Advanced Packaging
Department of Electronics

Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), Nakhla, M.S, & Achar, R. (2006). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. IEEE Transactions on Advanced Packaging, 29(1), 78–87. doi:10.1109/TADVP.2005.862656