Simulation of coupled interconnects using waveform relaxation and transverse partitioning

Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), M.S. Nakhla (Michel S.) and R. Achar (Ram)

2006-02-01

IEEE Transactions on Advanced Packaging , Volume 29 - Issue 1 p. 78- 87

Additional Metadata
Keywords	High-speed interconnects, Macromodeling, Parallel processing, Transient simulation, Transverse partitioning, Waveform relaxation
Persistent URL	dx.doi.org/10.1109/TADVP.2005.862656
Journal	IEEE Transactions on Advanced Packaging
Organisation	Department of Electronics
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), Nakhla, M.S, & Achar, R. (2006). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. IEEE Transactions on Advanced Packaging, 29(1), 78–87. doi:10.1109/TADVP.2005.862656

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