Additional Metadata
Keywords High-speed interconnects, Macromodeling, Parallel processing, Transient simulation, Transverse partitioning, Waveform relaxation
Persistent URL dx.doi.org/10.1109/TADVP.2005.862656
Journal IEEE Transactions on Advanced Packaging
Citation
Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), Nakhla, M.S, & Achar, R. (2006). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. IEEE Transactions on Advanced Packaging, 29(1), 78–87. doi:10.1109/TADVP.2005.862656