Simulation of coupled interconnects using waveform relaxation and transverse partitioning

Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), M.S. Nakhla (Michel S.) and R. Achar (Ram)

2006-02-01

IEEE Transactions on Advanced Packaging , Volume 29 - Issue 1 p. 78- 87

Additional Metadata
Keywords	High-speed interconnects, Macromodeling, Parallel processing, Transient simulation, Transverse partitioning, Waveform relaxation
Persistent URL	dx.doi.org/10.1109/TADVP.2005.862656
Journal	IEEE Transactions on Advanced Packaging
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style American-Institute-of-Physics Style Council-of-Science-Editors Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Nakhla, N.M. (Natalie M.), Ruehli, A.E. (Albert E.), Nakhla, M.S, & Achar, R. (2006). Simulation of coupled interconnects using waveform relaxation and transverse partitioning. IEEE Transactions on Advanced Packaging, 29(1), 78–87. doi:10.1109/TADVP.2005.862656

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