Additional Metadata
Persistent URL dx.doi.org/10.1109/EPEP.2007.4387194
Conference IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Citation
Sridhar, A. (Arvind), Nakhla, N. (Natalie), Achar, R, & Nakhla, M.S. (2007). Fast EMC analysis of high-speed interconnects via waveform relaxation and transverse partitioning. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 329–332). doi:10.1109/EPEP.2007.4387194