2007-12-01
Fast EMC analysis of high-speed interconnects via waveform relaxation and transverse partitioning
Publication
Publication
Presented at the
IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP (October 2007)
| Additional Metadata | |
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| Persistent URL | dx.doi.org/10.1109/EPEP.2007.4387194 |
| Conference | IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP |
| Citation |
Sridhar, A. (Arvind), Nakhla, N. (Natalie), Achar, R, & Nakhla, M.S. (2007). Fast EMC analysis of high-speed interconnects via waveform relaxation and transverse partitioning. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 329–332). doi:10.1109/EPEP.2007.4387194
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