Fast EMC analysis of high-speed interconnects via waveform relaxation and transverse partitioning

Sridhar, A. (Arvind), Nakhla, N. (Natalie), R. Achar (Ram) and M.S. Nakhla (Michel S.)

2007-12-01

Presented at the IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP (October 2007)

Additional Metadata
Persistent URL	dx.doi.org/10.1109/EPEP.2007.4387194
Conference	IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Citation APA Style AAA Style APA Style Cell Style Chicago Style Harvard Style IEEE Style MLA Style Nature Style Vancouver Style BibTex Format Endnote Format RIS Format CSL Format DOIs only Format	Sridhar, A. (Arvind), Nakhla, N. (Natalie), Achar, R, & Nakhla, M.S. (2007). Fast EMC analysis of high-speed interconnects via waveform relaxation and transverse partitioning. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 329–332). doi:10.1109/EPEP.2007.4387194

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