2008-12-31
Ultra wideband wireless serial data communication at 1OGb/s in CMOS 90nm
Publication
Publication
Presented at the
17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 (October 2008)
This paper presents a novel transmitter structure serving as a bridge between high-speed serial data and low power ultra wideband (UWB) communication. A current mode logic (CML) based finite impulse response (FIR) structure is used to spectrally shape the data at the rate of 10 Gb/s with 5.36pJ energy/bit consumption in CMOS 90nm technology. Stacked inductors are used for wireless chip-to-chip transmission.
| Additional Metadata | |
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| Persistent URL | dx.doi.org/10.1109/EPEP.2008.4675896 |
| Conference | 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 |
| Citation |
Siddiqui, S. (Sameera), & Kwasniewski, T. (2008). Ultra wideband wireless serial data communication at 1OGb/s in CMOS 90nm. Presented at the 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008. doi:10.1109/EPEP.2008.4675896
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