Additional Metadata
Keywords atomic layer deposition, carbene, copper amide, metal thin film, plasma
Persistent URL dx.doi.org/10.1021/cm400215q
Journal Chemistry of Materials
Citation
Coyle, J.P, Dey, G. (Gangotri), Sirianni, E.R. (Eric R.), Kemell, M.L. (Marianna L.), Yap, G.P.A. (Glenn P. A.), Ritala, M. (Mikko), … Barry, S.T. (2013). Deposition of copper by plasma-enhanced atomic layer deposition using a novel n-heterocyclic carbene precursor. Chemistry of Materials, 25(7), 1132–1138. doi:10.1021/cm400215q